New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels
Author:
Xie B.,Fan X.J.,Shi X.Q.
Reference23 articles.
1. IPC/JEDEC J-STD-020D.1, “Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices”, March 2008. 2. Shook, R., Vaccaro, R., Gerlach, D., “Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels”, Annual International Reliability Physics Symposium, pp. 214–219, 1998. 3. Shook, R., Conrad, T., Sastry, V., Steele, D., “Diffusion model to derate moisture sensitive surface mount IC’s for factory use conditions”, IEEE Transaction on Components, Packaging and Manufacturing Technology, 19(2), 110–118, 1996. 4. Shook, R.L., Goodelle, J.P., “Handling of highly-moisture sensitive components – an analysis of low-humidity containment and baking schedules”, IEEE Transaction on Electronics Packaging Manufacturing, 23(2), 81–86, 2000. 5. Shook, R.L., Gilbert, J.J., Thomas, E., “Impact of ingressed moisture and high temperature warpage behavior on the robust assembly capability for large body PBGAs”, Proceedings of Electronic Components and Technology Conference, pp. 1823–1828, 2003.
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