Peridynamic wetness approach for moisture concentration analysis in electronic packages-Reference-Cited by-同舟云学术

Peridynamic wetness approach for moisture concentration analysis in electronic packages

Published:2017-03 Issue: Volume:70 Page:103-111
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Diyaroglu C.,Oterkus S.,Oterkus E.,Madenci E.,Han S.,Hwang Y.

Funder

SAMSUNG

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Moisture/reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices;J-STD-020D,2008

2. Analysis of package cracking during reflow soldering process;Kitano,1988

3. Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels;Shook,1998

4. A new method for equivalent acceleration of JEDEC moisture sensitivity levels;Shi,2008

5. Moisture diffusion and vapor pressure modeling of IC packaging;Wong,1998

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