Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste-Reference-Cited by-同舟云学术

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Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste

Published:2013-06 Issue:6 Volume:3 Page:915-922
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Zheng Hanguang,Berry David,Calata Jesus N.,Ngo Khai D. T.,Luo Susan,Lu Guo-Quan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/6521404/06516053.pdf?arnumber=6516053

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging;Journal of Electronic Materials;2024-03-29

3. Reliability Inspection for Bilayer Nanosilver Paste Ensemble Pressureless Sintered Embedded Cooling SiC Power Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-02

4. Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm² Power Cycling Tests;IEEE Transactions on Power Electronics;2022-06

5. Development of anti-oxidation Ag salt paste for large-area (35 × 35 mm2) Cu-Cu bonding with ultra-high bonding strength;Journal of Materials Science & Technology;2022-06

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