Development of anti-oxidation Ag salt paste for large-area (35 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si1.svg"><mml:mo>×</mml:mo></mml:math> 35 mm2) Cu-Cu bonding with ultra-high bonding strength-Reference-Cited by-同舟云学术

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Development of anti-oxidation Ag salt paste for large-area (35 × 35 mm2) Cu-Cu bonding with ultra-high bonding strength

Published:2022-06 Issue: Volume:113 Page:261-270
ISSN:1005-0302
Container-title:Journal of Materials Science & Technology
language:en
Short-container-title:Journal of Materials Science & Technology

Author:

Zhang Bowen,Chen Chuantong,Sekiguchi Takuya,Liu Yang,Li Caifu,Suganuma Katsuaki

Funder

New Energy and Industrial Technology Development Organization

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference44 articles.

1. Wide bandgap semiconductor materials for high temperature electronics

2. Review of Silicon Carbide Power Devices and Their Applications

3. A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

4. Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bare copper bonding with facilely synthesized Ag nanoparticles decorated Cu microparticles paste;Journal of Materials Science: Materials in Electronics;2024-08

2. In situ epitaxial thickening of wafer-scale, highly oriented nanotwinned Ag on tailored polycrystalline Cu substrates;Acta Materialia;2024-04

3. Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-01

4. Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

5. Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions;Journal of Science: Advanced Materials and Devices;2023-09

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