Author:
Topal Emre,Gluch Jurgen,Clausner Andre,Cardoso Andre,Zschech Ehrenfried
Funder
European Commission as a part of the Electronic Components and Systems for European Leadership (ECSEL) joint undertaking project “EuroPAT-MASIP.”
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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1. Investigation of different thermomechanical behaviours in one batch of QFN packages;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
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3. Global-to-local finite element model of shear stress analysis on Fan-out wafer-level package;2022 IEEE 14th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM);2022-12-01
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