Global-to-local finite element model of shear stress analysis on Fan-out wafer-level package-Reference-Cited by-同舟云学术

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Global-to-local finite element model of shear stress analysis on Fan-out wafer-level package

Published:2022-12-01 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 14th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM)
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Author:

Conversion Ariel¹,Ubando Aristotle¹,Gonzaga Jeremias¹

Affiliation:

1. De La Salle University,Department of Mechanical Engineering,Manila,Philippines,0922

Funder

Research and Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10109352/10109274/10109588.pdf?arnumber=10109588

Reference14 articles.

1. Characterization of the viscoelastic properties of an epoxy molding compound during cure

2. Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound

3. Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement

4. Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers

5. Evaluation of Crack Propagation at the Interconnection Interface Induced by Warpage of Fan-Out Wafer-Level-Package

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