Ultrasonic Bonding of Ag and Ag-Alloy Ribbon—An Innovative Alternative for High Power IC Packages-Reference-Cited by-同舟云学术

Ultrasonic Bonding of Ag and Ag-Alloy Ribbon—An Innovative Alternative for High Power IC Packages

Published:2020-06 Issue:6 Volume:10 Page:1061-1068
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Chen Chun-Hao^ORCID,Lin Yan-Cheng,Groth Anne,Lai Yu-Chang,Lin Chia-Ying^ORCID,Chang Heng-Ming,Chuang Tung-Han^ORCID

Funder

Industrial and Academic Cooperation Programs of Wire Technology Company Ltd.

Ministry of Science and Technology, Taiwan

Doctoral Student Study Abroad Program 2019

German Academic Exchange Service (DAAD) by the short-term grants program 2019

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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2. Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization;International Journal of Manufacturing, Materials, and Mechanical Engineering;2023-11-14

5. Effect of Solder Voids on Chip Crack during Al Ribbon Bonding;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19