Effect of Solder Voids on Chip Crack during Al Ribbon Bonding
Author:
Affiliation:
1. IFMY BE DEV I SIM Infineon Technologies Malaysia Sdn.Bhd.,Melaka,Malaysia
2. IFMY BE DEV TO UPD FOL Infineon Technologies Malaysia Sdn.Bhd.,Melaka,Malaysia
3. IFMY BE DEV TO UPD FOL WB Infineon Technologies Malaysia Sdn.Bhd.,Melaka,Malaysia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9969384/9969385/09969482.pdf?arnumber=9969482
Reference9 articles.
1. Laser bonding of copper ribbons and clips on SiC power MOSFETs with sintered copper bond buffers
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3. Copper ribbon bonding for power electronics applications;marenco;2013 Eurpoean Microelectronics Packaging Conference (EMPC) EMPC,0
4. Ultrasonic Bonding of Ag and Ag-Alloy Ribbon—An Innovative Alternative for High Power IC Packages
5. Study on solder void for PiP large solder area ultrathin die in solder reflow
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