Glass–Glass Laser-Assisted Glass Frit Bonding

Author:

Cruz Rui,da Cruz Ranita João Alexandre,Macaira José,Ribeiro Fernando,da Silva Ana Margarida Batista,Oliveira José M.,Fernandes Maria Helena F. V.,Ribeiro Helena Aguilar,Mendes Joaquim Gabriel,Mendes Adélio

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Optimization of laser-based glass frit bonding for optoelectronic packaging using response surface methodology;Optics & Laser Technology;2025-02

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3. Absorptive Filtering Packaging Antenna Design Based on Through-Glass Vias;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-11

4. Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO2 Thin Films;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-09

5. Thick film of modified aluminum with conductivity similar to silver;MRS Communications;2023-05-25

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