1. D. Ortolino, A. Engelbrecht, H. Lauterbach, M. Braeu, J. Kita, R. Moos, Effect of repeated firing on the resistance of screen-printed thick-film conductors. J. Ceram. Sci. Technol. 5, 317–326 (2014)
2. J. Fang, R. Fu, X. Gu, G. Li, X. Zhang, The synthesis of multi-layer silver, copper and aluminum thick films on alumina substrates using a screen-printing method. J. Ceram. Sci. Technol. 11, 103–110 (2020)
3. Y. Cho, M. Koyuncu, W. Schulze, V. Amarakoon, Characterization of glass-ceramic dielectric thick films with Cu conductors for multilayer packages. MRS Proc. (2011). https://doi.org/10.1557/PROC-445-313
4. J. Hlina, J. Reboun, A. Hamacek, Multilayer thick printed copper structures, in Proceedings of the 2018 41st international spring seminar on electronics technology (ISSE). (ISSE, Zlatibor, 2018)
5. J. Hlina, J. Reboun, V. Hermansky, M. Simonovsky, J. Johan, A. Hamacek, Study of co-fired multilayer structures based on thick printed copper technology. Mater. Lett. 238, 313–316 (2019)