Funder
Ministry of Industry and Trade of the Czech Republic
Ministry of Education, Youth and Sports
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference11 articles.
1. A. Miric, P. Dietrich, Inorganic Substrates for Power Electronics Applications, 2013. (accessed 10 October 2018).
2. Development of a ceramic-based composite for direct bonded copper substrate;Akhtar;Ceram. Int.,2017
3. A new method for preparation of direct bonded copper substrate on Al2O3;He;Mater. Lett.,2007
4. Ceramic Interconnect Technology Handbook;Barlow,2007
5. Hybrid Microelectronics Handbook;Sergent,1995
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献