Author:
Akhtar S.S.,Kareem L.T.,Arif A.F.M.,Siddiqui M.U.,Hakeem A.S.
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Advantages and new development of direct bonded copper substrates;Schulz-Harder;Microelectron. Reliab.,2003
2. Y.S. Sun, J.C. Driscoll, IEEE Trans., IEEE Trans. Electron Devices, vol. 23, 1976, p. 961.
3. The direct bonding of metals to ceramics and application in electronics;Burgess;Active and Passive Electron. Compon.,1976
4. Thermal fatigue behaviour of Al2O3-DBC substrates under high temperature cyclic loading;Dong;Solder. Surf. Mt. Technol.,2010
5. Y.Liu, Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling., 2012.
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