Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration-Reference-Cited by-同舟云学术

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Published:2012-08 Issue:8 Volume:2 Page:1229-1238
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lee Ching-Kuan,Chang Tao-Chih,Lau John H.,Huang Yu-Jiau,Fu Huan-Chun,Huang Jui-Hsiung,Hsiao Zhi-Cheng,Ko Cheng-Ta,Cheng Ren-Shin,Chang Pei-Chen,Kao Kuo-Shu,Lu Yu-Lan,Lo Robert,Kao Ming-Jer

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/5503870/6255833/06195065.pdf?arnumber=6195065

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