Effects of surface diffusion and solder volume on porous-type Cu3Sn in Cu/Sn/Cu microjoints
Author:
Funder
National Taiwan University
Ministry of Science and Technology, Taiwan
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference17 articles.
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4. Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading;Materials;2023-07-26
5. Optimal doping elements for inhibiting surface-diffusion of adatoms on Cu3Sn;Applied Surface Science;2023-01
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