Author:
Arjmand Elaheh,Agyakwa Pearl A.,Corfield Martin R.,Li Jianfeng,Mark Johnson C.
Funder
U.K. Engineering and Physical Sciences Research Council through the HubNet Project
Dynex Semiconductors Ltd., for providing the dies and DBC substrate tiles
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
8 articles.
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