Impact of heat treatment on the lifetime of wire-bonded power modules

Author:

Brandelero J.,Pichon P.,Legros M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Damage evolution in Al wire bonds subjected to a junction temperature fluctuationof 30 K;Agyakwa;J. Electron. Mater.,2016

2. Élaboration et comparaison de deux modèles de durée de vie des fils d’interconnexion des modules de puissance, l’un basé sur les déformations et l’autre sur les dégradations;Dornic,2019

3. Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling;Agyakwa;Microelectron. Reliab.,2011

4. In-depth investigation of metallization aging in power MOSFETs;Ruffilli;Microelectron. Reliab.,2015

5. Aluminum metallization and wire bonding aging in power MOSFET modules;Ruffilli;Mater. Today Proc.,2018

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Increasing the Reliability of Aluminum Wirebonds by Thermal Treatments: Analysis and Implementation;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-06

2. Effect of post bonding annealing on the reliability of Al based wire bondings in IGBTs;Microelectronics Reliability;2022-11

3. High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-11

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