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A Novel Self-Feedback Intelligent Vision Measure for Fast and Accurate Alignment in Flip-Chip Packaging

  • Published:2020-03 Issue:3 Volume:16 Page:1776-1787
  • ISSN:1551-3203
  • Container-title:IEEE Transactions on Industrial Informatics
  • language:
  • Short-container-title:IEEE Trans. Ind. Inf.

Author:

Wu Zelong,Tang HuiORCID,Feng Zhaoyang,Wang Weimin,He Sifeng,Gao JianORCID,Chen Xin,He YunboORCID,Chen Xun

Funder

National Natural Science Foundation of China

Guangdong Programs for Science and Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Science Applications,Information Systems,Control and Systems Engineering

Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A global feature interaction network (GFINet) for image segmentation of GaN chips;Advanced Engineering Informatics;2024-10

2. In situ monitoring of flip chip package process using thermal resistance network method and active thermography;International Journal of Heat and Mass Transfer;2024-06

3. A Pin Classification Extraction Algorithm for Non-Standard Chips Based on Curve Detection;IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society;2023-10-16

4. A novel method for micro-nano channel alignment with automatic features based on reconstructed Hough transform theory;2023 IEEE 2nd International Conference on Electrical Engineering, Big Data and Algorithms (EEBDA);2023-02-24

5. A Novel Subpixel Industrial Chip Detection Method Based on the Dual-Edge Model for Surface Mount Equipment;IEEE Transactions on Industrial Informatics;2023-01
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