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Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

  • Published:2014-02 Issue:2 Volume:61 Page:533-539
  • ISSN:0018-9383
  • Container-title:IEEE Transactions on Electron Devices
  • language:
  • Short-container-title:IEEE Trans. Electron Devices

Author:

Fukushima Takafumi,Bea Jichoel,Kino Hisashi,Nagai Chisato,Murugesan Mariappan,Hashiguchi Hideto,Lee Kang-Wook,Tanaka Tetsu,Koyanagi Mitsumasa

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 34 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bendability Enhancement and Miniaturization of Through-X Via (TXV) Based on Flexible FOWLP with Tiny Cu Pillar Assembly;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Liquid Surface Tension-Driven Chip Self-Assembly Technology with Cu-Cu Hybrid Bonding for High-Precision and High-Throughput 3D Stacking of DRAM;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. PPC-based wafer-level temporary bonding/ debonding triggered by microwave;Informacije MIDEM - Journal of Microelectronics, Electronic Components and Materials;2024-02-13

4. Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Design and Validation of an Automation Strategy for the Strip Test Process in the Semiconductor Industry;2023 International Conference on Robotics and Automation in Industry (ICRAI);2023-03-03
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