Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck

Author:

Tokei Zs.,Vega V.,Murdoch G.,O'Toole M.,Croes K.,Baert R.,Veen M. Van der,Adelmann C.,Soulie J. P.,Boemmels J.,Wilson C.,Park S. H.,Sankaran K.,Pourtois G.,Sweerts J.,Paolillo S.,Decoster S.,Mao M.,Lazzarino F.,Versluijs J.,Blanco V.,Ercken M.,Kesters E.,Le Q-T.,Holsteyns F.,Heylen N.,Teugels L.,Devriendt K.,Struyf H.,Morin P.,Jourdan N.,Elshocht S. Van,Ciofi I.,Gupta A.,Zahedmanesh H.,Vanstreels K.,Na M. H.

Publisher

IEEE

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