1. Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects;IEEE Transactions on Semiconductor Manufacturing;2023-11
2. Novel Non-Destructive Physical Bitmap Verification Technique on SRAM and NOR Flash;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
3. Thermal Sensitivity Mapping with OBIRCH;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
4. Light Emission Tracking and Measurements for Analog Circuits Fault Diagnosis in Automotive Applications;Journal of Electronic Testing;2023-03-28
5. Design of Integrated Circuit Hard Defect Location System Based on Thermal Laser Stimulation;2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS);2022-11-11