FEM-based Thermal Profile Prediction for Thermal Management of System-on-Chips
Author:
Affiliation:
1. Polytechnique Montréal,Electrical Engineering Department,Montréal,QC,Canada,H3T 1J4
2. University of Québec in Outaouais,Department of Engineering Computer Science,Gatineau,QC,Canada,J8Y 3G5
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9933916/9933999/09934719.pdf?arnumber=9934719
Reference18 articles.
1. Electro-thermal and logi-thermal simulation of VLSI designs
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3. Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology;Electronics;2023-07-20
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