Slot Bow-Tie Antenna Integration in an Enhanced Flip-Chip QFN Package for WR8 and WR5 Band Applications-Reference-Cited by-同舟云学术

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Slot Bow-Tie Antenna Integration in an Enhanced Flip-Chip QFN Package for WR8 and WR5 Band Applications

Published:2021-12-17 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE MTT-S International Microwave and RF Conference (IMARC)
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Author:

Jogalekar Aditya N.¹,Medina Oscar F.¹,Blanchard Andrew¹,Henderson Rashaunda¹,Iyer Mahadevan K.¹,Tang Tony²,Murugan Rajen²,Ali Hassan²

Affiliation:

1. The University of Texas at Dallas,Eric Johnson School,Department of Elctrical and Computer Engineering,Richardson,TX,USA

2. Texas Instruments Inc., 12500, TI Blvd,Eric Johnson School,Department of Elctrical and Computer Engineering,Dallas,TX,USA,75243

Funder

Semiconductor Research Corporation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9714514/9714521/09714582.pdf?arnumber=9714582

Reference6 articles.

1. InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration

2. 122 GHz antenna-integration in a plastic package based on a flip chip interconnect

3. 3D Glass-Based Panel-Level Package with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications

4. 120-GHz and 240-GHz Broadband Bow-Tie Antennas in eWLB Package for High Resolution Radar Applications

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An integrated 60 GHz differential-fed patch array antenna in low-cost QFN package;Microelectronics Journal;2023-07

2. A Novel Approach to Measure and Characterize Radiation Patterns of Antenna-in-Package;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded Die Enhanced QFN Package for WR8 and WR5 Frequency Bands;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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