Novel E-beam Techniques for Inspection and Monitoring
Author:
Affiliation:
1. PDF Solutions Inc,Santa Clara,CA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9797886/9797892/09798308.pdf?arnumber=9798308
Reference5 articles.
1. Yield and Reliability Challenges at 7nm and Below;strojwas;Proc EDTM Conf,2019
2. Advanced high throughput e-beam inspection with DirectScan;strojwas;Proc NANOTS Conf,2021
3. In-line monitoring of overlay and process window using design-assisted voltage contrast inspection for 14nm FINFET technology
4. Smart E-Beam for Defect Identification & Analysis in the Nanoscale Technology Nodes: Technical Perspectives
5. Enhanced Reliability of 7nm Process Technology featuring EUV
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1. DFI Filler Cells – New Embedded Type of Test Structures for Non-Contact Detection of Electrical Defects on Product Wafers;2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS);2022-03-21
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