Enhanced Reliability of 7nm Process Technology featuring EUV-Reference-Cited by-同舟云学术

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Enhanced Reliability of 7nm Process Technology featuring EUV

Published:2019-06 Issue: Volume: Page:
ISSN:
Container-title:2019 Symposium on VLSI Technology
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Author:

Choi Kihyun,Sagong Hyun Chul,Kang Wonchang,Kim Hyunjin,Hai Jiang,Lee Miji,Kim Bomi,Lee Mi-ji,Lee Soonyoung,Shim Hyewon,Park Junekyun,Cho Youngwoo,Rhee Hwasung,Pae Sangwoo

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8766306/8776475/08776580.pdf?arnumber=8776580

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel E-beam Techniques for Inspection and Monitoring;2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2022-03-06

2. Correlation-Based Device Energy-Efficient Dynamic Multi-Task Offloading for Mobile Edge Computing;2021 IEEE 93rd Vehicular Technology Conference (VTC2021-Spring);2021-04

3. Opportunities in Device Scaling for 3-nm Node and Beyond: FinFET Versus GAA-FET Versus UFET;IEEE Transactions on Electron Devices;2020-06

4. Enhanced Reliability of 7-nm Process Technology Featuring EUV;IEEE Transactions on Electron Devices;2019-12

5. Requirements of data technology for EUV photomask;Photomask Technology 2019;2019-09-26

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