An ECC-Assisted Postpackage Repair Methodology in Main Memory Systems
Author:
Funder
Samsung Fellowship
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
http://xplorestaging.ieee.org/ielx7/92/7956364/07884987.pdf?arnumber=7884987
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Run Time Memory Error Recovery Process in Networking System;2023 7th International Conference on System Reliability and Safety (ICSRS);2023-11-22
2. ECC-Aware Fast and Reliable Pattern Matching Redundancy Analysis for Highly Reliable Memory;IEEE Access;2021
3. Extraction of wearout model parameters using on-line test of an SRAM;Microelectronics Reliability;2020-11
4. Highly Reliable Memory Architecture Using Adaptive Combination of Proactive Aging-Aware In-Field Self-Repair and ECC;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2020-08
5. Address Remapping Techniques for Enhancing Fabrication Yield of Embedded Memories;Journal of Electronic Testing;2018-07-16
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