A PCB based package and 3D assembly for high power density converters-Reference-Cited by-同舟云学术

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A PCB based package and 3D assembly for high power density converters

Published:2019-04 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)
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Author:

Mrad Roberto,Morand Julien,Perrin Remi,Mollov Stefan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8786827/8799071/08799099.pdf?arnumber=8799099

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and Optimization of 100 V GaN Multi-chip Power Micromodule Based on AlN DBC Substrate;2024 IEEE 25th International Conference of Young Professionals in Electron Devices and Materials (EDM);2024-06-28

2. Graphite Heat Spreader Embedded in a PCB Package for Improved SiC Die RthJC;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

3. A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC–DC Converter;IEEE Transactions on Power Electronics;2022-10

4. Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-12

5. A PCB based package with thermal resistance improvement;2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe);2021-09-06

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