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Modeling and Analysis of Silver-Sintered Molybdenum Packaging for SiC Power Modules With Improved Lifetime and Temperature Range

  • Published:2021-12 Issue:12 Volume:11 Page:2102-2113
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Yang YuhangORCID,Tseng Yu-Chih,Rodriguez RominaORCID,Dorneles Callegaro AlanORCID,Emadi AliORCID

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Predictive Synthesis of Transition Metal Carbide via Thermochemical Oxocarbon Equilibrium;Journal of the American Chemical Society;2024-05-29

2. Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging;IEEE Transactions on Power Electronics;2023-09

3. Preparation of Nano-foam Sheet and Its Application in High Temperature Packaging of Power Chips;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. Novel SiC-Based Power Device Bonding Materials of Nano Foam Sheet and Its Characteristic and Properties;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-06

5. Multilevel Inverters for Electric Aircraft Applications: Current Status and Future Trends;IEEE Transactions on Transportation Electrification;2023
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