Compact 3D-Printed Jet-Impingement Nozzle for Top-Side-Cooled GaN Power Devices
Author:
Affiliation:
1. University of Toronto,The Edward S. Rogers Sr. Department of Electrical & Computer Engineering,Canada
2. University of Toronto,Department of Mechanical & Industrial Engineering,Canada
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9829904/9829946/09830031.pdf?arnumber=9830031
Reference18 articles.
1. Single-phase microchannel cold plate for hybrid vehicle electronics
2. GaN Transistors Cooling Options Comparison
3. 3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors
4. GS66508T-GaN Systems;GaN Systems,2022
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1. Experimental study on the control of temperature oscillation in power electronics via pulsating jet impingement;International Journal of Thermal Sciences;2024-10
2. High Heat-Flux Removal From Topside-Cooled GaN Power Devices by Water-Jet Impingement Using 3-D-Printed Nozzles;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08
3. Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-06
4. Seven-Level Flying-Capacitor Multi-Level Converter for a Differential Power-Processing Interface in Multi-Chemistry EV Battery Packs;2023 IEEE Applied Power Electronics Conference and Exposition (APEC);2023-03-19
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