Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review-Reference-Cited by-同舟云学术

Jet Impingement Heat Sinks With Application Toward Power Electronics Cooling: A Review

Published:2023-06 Issue:6 Volume:13 Page:765-787
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Klinkhamer Corey¹^ORCID,Iyer K. Lakshmi Varaha²,Etemadi Majed¹^ORCID,Balachandar Ram¹^ORCID,Barron Ron¹^ORCID

Affiliation:

1. Department of Mechanical, Automotive and Materials Engineering, University of Windsor, Windsor, Canada

2. Magna International Inc., Troy, MI, USA

Funder

Natural Sciences and Engineering Research Council of Canada

Mitacs

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference171 articles.

2. Multiple impinging jet arrays: An experimental study on flow and heat transfer;geers,2004

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