High Heat-Flux Removal From Topside-Cooled GaN Power Devices by Water-Jet Impingement Using 3-D-Printed Nozzles-Reference-Cited by-同舟云学术

High Heat-Flux Removal From Topside-Cooled GaN Power Devices by Water-Jet Impingement Using 3-D-Printed Nozzles

Published:2023-08 Issue:8 Volume:13 Page:1164-1173
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Ramaraju Ramgopal Varma¹^ORCID,Zaman Mohammad Shawkat²^ORCID,Passandideh-Fard Mohammad³,Trescases Olivier²^ORCID,Chandra Sanjeev¹^ORCID

Affiliation:

1. Department of Mechanical and Industrial Engineering, Center for Advanced Coating Technologies (CACT), University of Toronto, Toronto, Canada

2. Edward S. Rogers Sr. Department of Electrical and Computer Engineering, University of Toronto Electric Vehicle (UTEV) Research Center, University of Toronto, Toronto, Canada

3. Department of Mechanical and Industrial Engineering, Center for Advanced Coating Technologies, University of Toronto, Toronto, Canada

Funder

Natural Sciences and Engineering Research Council (NSERC) of Canada

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10255328/10225372.pdf?arnumber=10225372

Reference27 articles.

1. A single phase hybrid micro heat sink using impinging micro-jet arrays and microchannels

2. Heat transfer characteristics of hybrid microjet – Microchannel cooling module

3. Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance

4. S3-P10: Embedded microfluidic cooling of high heat flux electronic components

5. Direct Single Impinging Jet Cooling of a mosfet Power Electronic Module

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. In-Chip Microfluidic Cooling Integrated on GaN Power IC Reaching High Power Density of 78 kW/l;IEEE Transactions on Power Electronics;2024-08