Enhanced Interconnect Test Method for Resistive Open Defects in Final Tests with Relaxation Oscillators-Reference-Cited by-同舟云学术

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Enhanced Interconnect Test Method for Resistive Open Defects in Final Tests with Relaxation Oscillators

Published:2022-11 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 31st Asian Test Symposium (ATS)
language:
Short-container-title:

Author:

Ohmatsu Masao¹,Ohtera Yuto¹,Ikiri Yuki²,Yotsuyanagi Hiroyuki³,Lu Shyue-Kung⁴,Hashizume Masaki³

Affiliation:

1. Graduate School of Sciences and Technology for Innovation, Tokushima University,Tokushima,Japan

2. Graduate School of Advanced Technology and Science, Tokushima University,Tokushima,Japan

3. National Taiwan University of Science and Technology,Department of Electrical Engineering,Taipei,Taiwan

4. Graduate School of Technology, Industrial and Social Sciences Tokushima University,Tokushima,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9978942/9978943/09979015.pdf?arnumber=9979015

Reference11 articles.

1. Boundary-Scan Test

2. Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST

3. A new IEEE 1149.1 boundary scan design for the detection of delay defects

4. A Study of Solder Joint Failure Criteria

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