Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST-Reference-Cited by-同舟云学术

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Ball Grid Array (BGA) Solder Joint Intermittency Detection: SJ BIST

Published:2008-03 Issue: Volume: Page:
ISSN:
Container-title:2008 IEEE Aerospace Conference
language:
Short-container-title:

Author:

Hofmeister James P.,Lall Pradeep,Panchagade Dhananjay,Roth Norman N.,Tracy Terry A.,Judkins Justin B.,Harris Kenneth L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4505446/4526225/04526624.pdf?arnumber=4526624

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation;Microelectronics International;2024-04-15

2. Modern Trends in Microelectronics Packaging Reliability Testing;Micromachines;2024-03-15

3. Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process;Microelectronics Reliability;2023-07

4. Design for Testability Methods for Detecting Resistive Opens at Chip Interconnects;Journal of The Japan Institute of Electronics Packaging;2023-03-01

5. DDR4 Ball Grid Array Package Intermittent Fracture Effect on Signal Integrity;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01

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