Influence of Thermal Coupling on Lifetime Under Power Cycling Test
Author:
Affiliation:
1. State Key Laboratory of Alternate Electrical Power System With Renewable Energy Sources, North China Electric Power University, Beijing, China
Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9837805/09795132.pdf?arnumber=9795132
Reference22 articles.
1. Junction Temperature Optimization Based Compensation Strategy of Modular Multilevel Railway Power Conditioner
2. Spatial Electro-Thermal Modeling and Simulation of Power Electronic Modules
3. Validity of power cycling lifetime models for modules and extension to low temperature swings
4. Difference in Device Temperature Determination Using p-n-Junction Forward Voltage and Gate Threshold Voltage
5. Cu Clip-Bonding Method With Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module
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