Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors-Reference-Cited by-同舟云学术

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Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

Published:2020-09 Issue:9 Volume:35 Page:8956-8964
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Samavatian Vahid^ORCID,Iman-Eini Hossein^ORCID,Avenas Yvan^ORCID,Samavatian Majid

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9088165/08993852.pdf?arnumber=8993852

Cited by 39 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Estimation of Void Area and Position in Solder Layer of Power Semiconductor Devices Based on Temperature Distribution Characteristics;Electronics;2024-09-06

2. Deep Neural Network-Based Temperature Mapping Technique for Heat Sink on Electronic Devices Using Local Thermocouple Sensors;Applied Artificial Intelligence;2024-08-12

3. Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach;2024-07-18

4. Effect of solder void on mechanical and thermal properties of flip-chip light-emitting diode: Statistical analysis based on finite element modeling;Heliyon;2024-06

5. Investigation on reproduction of IGBT die-attach solder degradation with finite element thermal-mechanical simulation;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

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