Deep Neural Network-Based Temperature Mapping Technique for Heat Sink on Electronic Devices Using Local Thermocouple Sensors-Reference-Cited by-同舟云学术

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Deep Neural Network-Based Temperature Mapping Technique for Heat Sink on Electronic Devices Using Local Thermocouple Sensors

Published:2024-08-12 Issue:1 Volume:38 Page:
ISSN:0883-9514
Container-title:Applied Artificial Intelligence
language:en
Short-container-title:Applied Artificial Intelligence

Author:

Shin Jaehee¹,Ahn Hyun²,Mun Gwang-Hyeon²,Lee Jeongmin¹,Zaghari Pouria³,Park Young-Min⁴,Park Jinhyoung¹,Ryu Jong Eun³,Jang Dong-Won²^ORCID

Affiliation:

1. Department of Mechatronics Engineering, Korea University of Technology & Education, Cheonan-si, Republic of Korea

2. Department of Mechanical Engineering, Myongji University, Yongin-si, Republic of Korea

3. Department of Mechanical and Aerospace Engineering, NC State University, Raleigh, North Carolina, USA

4. IPS Team, Hanwha Systems, Gyeongsangbuk-do, Republic of Korea

Funder

National Research Foundation of Korea

Korea Research Institute for defense Technology planning and advancement

Korea Institute for the Advancement of Technology

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/08839514.2024.2389374

Reference45 articles.

1. Violence Detection in Videos by Combining 3D Convolutional Neural Networks and Support Vector Machines

2. Performance evaluation of a conformal thermal monitoring sheet sensor array for measurement of surface temperature distributions during superficial hyperthermia treatments

3. High-performance flexible metal-on-silicon thermocouple

4. Infrared thermography for condition monitoring – A review

5. Deep Learning for Tomato Diseases: Classification and Symptoms Visualization

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