Author:
Saito Mitsuko,Yoshida Yoichi,Miura Noriyuki,Ishikuro Hiroki,Kuroda Tadahiro
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Cited by
9 articles.
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1. Design of SRAM Based Interface Module with DMA in Inductive-Coupling 3D Stacked IoT Chips;2022 2nd International Conference on Intelligent Technology and Embedded Systems (ICITES);2022-09-23
2. Ferrite-Less Frequency-Tuned Printed-Coil Resonator With Rear Metallic Plate for RFID Applications;IEEE Journal of Radio Frequency Identification;2021-03
3. A 96-MB 3D-Stacked SRAM Using Inductive Coupling With 0.4-V Transmitter, Termination Scheme and 12:1 SerDes in 40-nm CMOS;IEEE Transactions on Circuits and Systems I: Regular Papers;2021-02
4. 3D Layout of Spidergon, Flattened Butterfly and Dragonfly on a Chip Stack with Inductive Coupling Through Chip Interface;2017 14th International Symposium on Pervasive Systems, Algorithms and Networks & 2017 11th International Conference on Frontier of Computer Science and Technology & 2017 Third International Symposium of Creative Computing (ISPAN-FCST-ISCC);2017-06
5. A simultaneously bidirectional inductively coupled link in a 0.13-µm CMOS technology;International Journal of Circuit Theory and Applications;2016-07-05