Impact of moisture/reflow induced delaminations on integrated circuit thermal performance
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx2/2969/8412/00367543.pdf?arnumber=367543
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Post-Silicon Characterization and On-Line Prediction of Transient Thermal Field in Integrated Circuits Using Thermal System Identification;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-01
2. Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections;Moisture Sensitivity of Plastic Packages of IC Devices;2010
3. High temperature humidity sensors based on sputtered Y-doped BaZrO3 thin films;Sensors and Actuators B: Chemical;2009-04-02
4. Reactive sputtered TiO2 thin film humidity sensor with negative substrate bias;Sensors and Actuators B: Chemical;2001-06
5. Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von Kármán's equations with consideration of thermoelastic strains;International Journal of Solids and Structures;1997-08
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