Author:
Chow L.L.W.,Yuen M.M.F.,Chan P.C.H.,Cheung A.T.
Subject
Materials Chemistry,Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. A model for moisture induced corrosion failures in microelectronic packages;Pecht;IEEE Trans. Components Hybrids Manufact. Technol.,1990
2. Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling;Tanaka;IEEE Trans. Components Packag. Technol.,1999
3. T.R. Conrad, R.L. Shook, Impact of moisture/reflow induced delaminations on integrated circuit thermal performance, in: Proceedings of the IEEE Electronic Components and Technology Conference, New York, NY, USA, 1994, pp. 527–531.
4. M. Pecht, L. Nguyen, E. Hakim, in: M. Pecht (Ed.), Plastic Encapsulated Microelectronics, Wiley, New York, 1995, pp. 175–194 (Chapter 4).
5. Effect of Li+ doping on ZrO2–TiO2 humidity sensor;Jain;Sens. Actuators B,1999
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