Author:
Minki Cho ,Ahmed Khondker Zakir,Song William J.,Yalamanchili Sudhakar,Mukhopadhyay Saibal
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Measurement-Based Compact Thermal Model Extraction Methodology for Packaged ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2017-11