Characterization of a no-flow underfill encapsulant during the solder reflow process-Reference-Cited by-同舟云学术

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Characterization of a no-flow underfill encapsulant during the solder reflow process

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Container-title:1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)
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Author:

Wong C.P.,Baldwin D.,Vincent M.B.,Fennell B.,Wang L.J.,Shi S.H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/5582/14953/00678898.pdf?arnumber=678898

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