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Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy

  • Published:2009-10 Issue:4 Volume:32 Page:221-232
  • ISSN:1521-334X
  • Container-title:IEEE Transactions on Electronics Packaging Manufacturing
  • language:
  • Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Mysore K.,Subbarayan G.,Gupta V.,Ron Zhang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

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