Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow-Reference-Cited by-同舟云学术

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Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Published:2002-10 Issue:4 Volume:25 Page:279-283
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:en
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Zhang Z.,Guo-Quan Lu

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/26423/01176910.pdf?arnumber=1176910

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