Molecular Dynamics Study on Plasma-Surface Interactions of SiCN Dielectrics for Wafer-to-Wafer Hybrid Bonding Process
Author:
Affiliation:
1. Samsung Electronics,Mechatronics Research,Hwaseong-si,Gyeonggi-do,South Korea,18448
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013205.pdf?arnumber=10013205
Reference17 articles.
1. Modeling solid-state chemistry: Interatomic potentials for multicomponent systems
2. Effect of carbon content on structural and mechanical properties of SiCN by atomistic simulations
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5. The ReaxFF reactive force-field: development, applications and future directions
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