Plasma Modeling Framework on Dielectric Surfaces in Hybrid Bonding Technology-Reference-Cited by-同舟云学术

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Plasma Modeling Framework on Dielectric Surfaces in Hybrid Bonding Technology

Published:2023-12-05 Issue: Volume: Page:211-215
ISSN:
Container-title:2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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Author:

Dag Sefa¹,Jiang Liu¹,Hung Raymond²,Lianto Prayudi²,An Jinho²,See Gilbert²,Bazizi El Mehdi¹

Affiliation:

1. Applied Materials,United States of America

2. Applied Materials,Singapore

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457604.pdf?arnumber=10457604

Reference17 articles.

1. Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

2. Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding

3. Heterogeneous Integration for Performance and Scaling

4. An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications

5. Heterogeneous Integration Challenges Within Wafer Level Fan-Out SiP for Wearables and IoT

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. D2W Hybrid Bonding Challenges for HBM;2024 IEEE International Memory Workshop (IMW);2024-05-12

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