Demonstration of 50 nm Overlay Accuracy for Wafer-to-Wafer Bonding and Further Improvement Study-Reference-Cited by-同舟云学术

Demonstration of 50 nm Overlay Accuracy for Wafer-to-Wafer Bonding and Further Improvement Study

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Mitsuishi Hajime¹,Mori Hiroshi¹,Maeda Hidehiro¹,Ushijima Mikio¹,Aramata Masanori¹,Fukuda Minoru¹,Okada Masashi¹,Kanbayashi Masahiro¹,Shimoda Toshimasa¹,Sugaya Isao¹

Affiliation:

1. NIKON CORPORATION,Yokohama,Kanagawa,Japan,244-8533

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013152.pdf?arnumber=10013152

Reference7 articles.

1. Wafer to Wafer Hybrid Bonding for DRAM Applications

2. Unleash Scaling Potential of 3D NAND with Innovative Xtacking® Architecture

3. High-Precision Wafer-Level Cu–Cu Bonding for 3-DICs

4. 3D-optimized SRAM Macro Design and Application to Memory-on-Logic 3D-IC at Advanced Nodes

5. Systems Interconnect: The 3D Landscape and High Bandwidth Optical I/O's;absil;Imec Technology Forum Japan Presentation material,2016

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