SiC Fan-out Wafer Level Package for High Power Application
Author:
Affiliation:
1. Fraunhofer IZM,Germany
2. Technische Universität Berlin,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013212.pdf?arnumber=10013212
Reference15 articles.
1. Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor
2. Wafer Level Embedding Technology for Packaging of Planar GaN Half-Bridge Module in High Power Density Conversion Applications;manier;PCIM Europe 2018 International Exhibition and Conference for Power Electronics Intelligent Motion Renewable Energy and Energy Management,0
3. Embedded benzocyclobutene in silicon: An integrated fabrication process for electrical and thermal isolation in MEMS
4. Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
5. Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
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