Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science
Cited by
5 articles.
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1. Partial Image Expansion Applied to Real Near-Field Measurement Data Modeling;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
2. A New Method Exploiting Partial Image Expansion to Include Substrate and Ground in Dipole-Based Near-Field Models;IEEE Transactions on Electromagnetic Compatibility;2023-12
3. Positioning Uncertainty of Near-Field Probes;2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON);2023-01-19
4. Test Design Methodology for Time-Domain Immunity Investigations Using Electric Near-Field Probes;IEEE Transactions on Electromagnetic Compatibility;2022-06
5. Analysis of Near-Field Probing Techniques for Immunity Tests;2022 ESA Workshop on Aerospace EMC (Aerospace EMC);2022-05-23