New Diagnostic Forensic Protocol for Damaged Secure Digital Memory Cards
Author:
Affiliation:
1. Centre de Recherche de la Gendarmerie Nationale (CREOGN), Melun, France
2. Information Security Group, Royal Holloway, University of London, Egham, Surrey, U.K.
3. Laboratoire Xlim UMR CNRS 7252, Université de Limoges, Limoges, France
Funder
National Research Agency under the Investments for the Future Program through Sigma-LIM
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science
Link
http://xplorestaging.ieee.org/ielx7/6287639/9668973/09733364.pdf?arnumber=9733364
Reference45 articles.
1. A Sample Preparation on Decapsulation Methodology for Effective Failure Analysis on Thin Small Leadless (TSLP) Flip Chip Package with Copper Pillar (CuP) Bump Interconnect Technology
2. Removing epoxy underfill between neighbouring components using acid for component chip-off
3. Impact of X-Ray Exposure on a Triple-Level-Cell NAND Flash
4. A study on the short- and long-term effects of X-ray exposure on NAND Flash memories
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