Removing epoxy underfill between neighbouring components using acid for component chip-off

Author:

Heckmann ThORCID,McEvoy J.P.,Markantonakis K.,Akram R.N.ORCID,Naccache D.

Publisher

Elsevier BV

Subject

Law,Medical Laboratory Technology,Computer Science Applications

Reference13 articles.

1. Forensic data recovery from flash memory;Breeuwsma;Small Scale Digital Device Forensics Journal,2007

2. How cell phone ”forensic” tools actually work-proposed leveling system;Brother,2009

3. Reverse Engineering Flash EEPROM Memories Using Scanning Electron Microscopy;Courbon,2017

4. Thermal characterization of an epoxy-based underfill material for flip chip packaging;He;Thermochim. Acta,2000

5. Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics;Heckmann;Digit. Invest.,2017

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