Hierarchical Attention Module-Based Hotspot Detection in Wafer Fabrication Using Convolutional Neural Network Model-Reference-Cited by-同舟云学术

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Hierarchical Attention Module-Based Hotspot Detection in Wafer Fabrication Using Convolutional Neural Network Model

Published:2024 Issue: Volume:12 Page:92840-92855
ISSN:2169-3536
Container-title:IEEE Access
language:
Short-container-title:IEEE Access

Author:

Shahroz Mobeen¹^ORCID,Ali Mudasir²^ORCID,Tahir Alishba¹^ORCID,Fabian Gongora Henry³^ORCID,Uc Rios Carlos³^ORCID,Abdus Samad Md⁴^ORCID,Ashraf Imran⁴^ORCID

Affiliation:

1. Department of Artificial Intelligence, The Islamia University of Bahawalpur, Bahawalpur, Punjab, Pakistan

2. Department of Computer Science, The Islamia University of Bahawalpur, Bahawalpur, Punjab, Pakistan

3. Universidad Europea del Atlántico, Santander, Spain

4. Department of Information and Communication Engineering, Yeungnam University, Gyeongsan-si, Republic of Korea

Funder

European University of Atlantic, Spain

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/6287639/10380310/10583874.pdf?arnumber=10583874

Reference60 articles.

1. Review of Wafer Surface Defect Detection Methods

2. A Systematic Review of Deep Learning for Silicon Wafer Defect Recognition

3. Optical wafer defect inspection at the 10 nm technology node and beyond

4. Out-of-Distribution (OOD) Detection Based on Deep Learning: A Review

5. The End of Moore's Law: A New Beginning for Information Technology

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